Products

LAK- Series Release Lak

LAK- Series Release Lak

Applications
In cold glue applications, it is designed to prevent the ink in the wound bobbin from being picked up by the glue during unwinding.

Underprint Material

  • Polyethylene LDPE-HDPE
  • BOPP, OPP, Pearlize OPP Film
  • Aluminum Foil
  • Metallized OPP
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